It is a device for chamfering wafer peripheral molding and notch molding. This device is developed according to high-precision digital control method. It can process wafers accurately and efficiently. Each device is equipped with two grinding sections. Each grinding section has the functions of coarse grinding and fine grinding. At the same time, two pieces are ground. The mechanical hip picking piece is used, and the optical sensor performs wafer position alignment. After the finished product is processed, it is recycled to the inside of the stack in a dry state by spin drying. The function of processing data such as feedback thickness and chamfer can be adjusted to make the upper and lower chamfers consistent. It is possible to perform peripheral processing, OF edge, and notch processing on the wafer, and it is possible to process the irregular shape, and it is possible to simultaneously process different types of workpieces on both A and B mesas。